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Interposer and Fan-Out WLP Market, by Technology (Through-silicon vias (TSVs), Interposers, Fan-out wafer-level packaging (FOWLP), Application (Logic, Imaging & optoelectronics, Memory, MEMS/sensors, LED, Power, analog & mixed signal, RF, photonic), End-User Industry (Consumer electronics, Telecommunication, Industrial sector, Automotive, Military and aerospace, Smart technologies, Medical devices) – Global Revenue, Trends, Growth, Share, Size and Forecast To 2022

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Through-silicon Vias (TSVs) is one of the most compact package types with increased functionality. TSV has gained popularity in space-constrained mobile applications and is used in portable consumer devices as well as industrial products as it is a cost-effective, compact, lightweight, and high-performing semiconductor. The use of interposer and fan-out WLP is expected to provide a cost-effective solution and drive the wide-scale adoption of this technology in potential end products. The average number of stacked dice in memory modules is likely to grow with the increasing usage of interposers. Moreover, innovations in advanced data storage such as flash memory, hybrid memory cube, and so on are creating a demand for interposer and fan-out WLP to develop high-performing compact memory solutions. In addition, the advent of complex device designs has brought new challenges in interconnections such as need for higher I/O density and performance requirements, which are efficiently addressed by interposer and fan-out WLP.

The report on the global Interposer and Fan-Out WLP Market uses the top-down and bottom-up approaches to define, analyze, and describe the market trends for the next five years. The report also tracks the emerging applications, innovative technologies, and mergers & acquisitions. It also focuses on the growth drivers and restraints for the key market players during the forecast period.

KEY BENEFITS OF THE REPORT

  • In-depth analysis of the market ecosystem and its impact on the revenue growth
  • Understanding of the strategies that are being adopted by the key players in this market to stay competitive
  • Valuable insights into the key technological and market trends impacting this market

KEY PREMIUM INDUSTRY INSIGHTS

  • The use of interposer and fan-out WLP is expected to provide a cost-effective solution and drive the wide-scale adoption of this technology in potential end products. The rising demand for advanced memory packages such as flash and hybrid memory, image sensors, and others in the consumer electronics industry is driving the growth of this market.
  • The average number of stacked dice in memory modules is likely to grow with the increasing usage of interposers. Moreover, innovations in advanced data storage such as flash memory, hybrid memory cube, and so on are creating a demand for interposer and fan-out WLP to develop high-performing compact memory solutions.
  • In addition, the advent of complex device designs has brought new challenges in interconnections such as need for higher I/O density and performance requirements, which are efficiently addressed by interposer and fan-out WLP.

On the basis of geography, the parking management market may be categorized into regions such as North America, Europe, Asia Pacific, Latin America, and the Middle East and Africa. APAC region will be the fastest-growing market for interposer and fan-out WLP during the forecast period. The major factors driving the growth of the market in APAC include the presence of major semiconductor foundries, including TSMC (Taiwan) and UMC (Taiwan); proximity to major downstream electronics manufacturing operations; government-sponsored infrastructure support; tax incentives; and availability of skilled engineers and labor at a relatively low cost.

RESEARCH METHODOLOGY

The research methodology for Scalar Market Research’s Interposer and Fan-Out WLP Market report utilizes a combination of top-down and bottom-up research formats. Our primary focus on continuous market tracking, rigorous fact-checking, data-triangulation, and multiple layers of quality control ensures high-quality data that can be leveraged for actionable research insights.

To know about the assumptions considered for the study, Download PDF Sample.

MARKET SEGMENTATION

This report analyzes the Interposer and Fan-Out WLP Market by the following segments:

  • Interposer and Fan-Out WLP Market, by Packaging Technology
    • Through-silicon vias (TSVs)
    • Interposers
    • Fan-out wafer-level packaging (FOWLP)
  • Interposer and Fan-Out WLP Market, by Application
    • Logic
    • Imaging & optoelectronics
    • Memory
    • MEMS/sensors
    • LED
    • Power, analog & mixed signal, RF, photonics
  • Interposer and Fan-Out WLP Market, by End-User Industry
    • Consumer electronics
    • Telecommunication
    • Industrial sector
    • Automotive
    • Military and aerospace
    • Smart technologies
    • Medical devices

KEY MARKET PLAYERS

Key players in the Interposer and Fan-Out WLP Market include:

  • Taiwan Semiconductor Manufacturing Company Limited
  • Samsung Electronics Co., Ltd.
  • Toshiba Corp.
  • ASE Group
  • Qualcomm Incorporated
  • Texas Instruments
  • Amkor Technology
  • United Microelectronics Corp.
  • Stmicroelectronics NV
  • Broadcom Ltd.

GEOGRAPHIC COVERAGE AND ANALYSIS

This granular market research report covers the following geographic regions in great detail:

  • NORTH AMERICA
    • U.S.
    • Rest of North America
  • EUROPE
    • France
    • Germany
    • U.K.
    • Rest of Europe
  • ASIA-PACIFIC
    • China
    • India
    • Japan
    • Rest of Asia-Pacific
  • MIDDLE EAST & AFRICA
    • GCC
    • North Africa
    • South Africa
    • Rest of Middle East & Africa
  • LATIN AMERICA
    • Brazil
    • Rest of Latin America

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  1. MARKET OVERVIEW
    1. Market Definitions
    2. Research Methodology
    3. Market Segmentation
  2. EXECUTIVE SUMMARY
  3. MARKET DYNAMICS
    1. Drivers
    2. Restraints
    3. Opportunities
    4. Premium Industry Trends
  4. INDUSTRY ANALYSIS
    1. Value Chain Analysis
    2. Technology Roadmap
  5. INTERPOSER AND FAN-OUT WLP MARKET, BY PACKAGING TECHNOLOGY
    1. Segment Share
    2. By Packaging Technology
      1. Through-silicon vias (TSVs)
      2. Interposers
      3. Fan-out wafer-level packaging (FOWLP)
  6. INTERPOSER AND FAN-OUT WLP MARKET, BY APPLICATION
    1. Segment Share
    2. By Application
      1. Logic
      2. Imaging & optoelectronics
      3. Memory
      4. MEMS/sensors
      5. LED
      6. Power, analog & mixed signal, RF, photonics
  7. INTERPOSER AND FAN-OUT WLP MARKET, BY END-USER INDUSTRY
    1. Segment Share
    2. By End-user Industry
      1. Consumer electronics
      2. Telecommunication
      3. Industrial sector
      4. Automotive
      5. Military and aerospace
      6. Smart technologies
      7. Medical devices
  8. INTERPOSER AND FAN-OUT WLP MARKET, BY GEOGRAPHY
    1. Segment Share
    2. North America
      1. By Regions
        1. U.S.
        2. Rest of North America
      2. By Packaging Technology
      3. By Application
      4. By End-user Industry
    3. Europe
      1. By Region
        1. France
        2. Germany
        3. U.K.
        4. Rest of Europe
      2. By Packaging Technology
      3. By Application
      4. By End-user Industry
    4. Asia-Pacific
      1. By Region
        1. China
        2. India
        3. Japan
        4. Rest of Asia-Pacific
      2. By Packaging Technology
      3. By Application
      4. By End-user Industry
    5. Middle East & Africa
      1. By Region
        1. GCC
        2. North Africa
        3. South Africa
        4. Rest of Middle East & Africa
      2. By Packaging Technology
      3. By Application
      4. By End-user Industry
    6. Latin America
      1. By Region
        1. Brazil
        2. Rest of Latin America
      2. By Packaging Technology
      3. By Application
      4. By End-user Industry
  9. COMPETITIVE LANDSCAPE
    1. Market Positioning of Key Players, 2016
    2. Key Innovators
  10. KEY MARKET PLAYERS
    1. Taiwan Semiconductor Manufacturing Company Limited
      1. Overview
      2. Key Strategies
      3. Key Developments
    2. Samsung Electronics Co., Ltd.
      1. Overview
      2. Key Strategies
      3. Key Developments
    3. Toshiba Corp.
      1. Overview
      2. Key Strategies
      3. Key Developments
    4. ASE Group
      1. Overview
      2. Key Strategies
      3. Key Developments
    5. Qualcomm Incorporated
      1. Overview
      2. Key Strategies
      3. Key Developments
    6. Texas Instruments
      1. Overview
      2. Key Strategies
      3. Key Developments
    7. Amkor Technology
      1. Overview
      2. Key Strategies
      3. Key Developments
    8. United Microelectronics Corp.
      1. Overview
      2. Key Strategies
      3. Key Developments
    9. Stmicroelectronics NV
      1. Overview
      2. Key Strategies
      3. Key Developments
    10. Broadcom Ltd.
      1. Overview
      2. Key Strategies
      3. Key Developments
  11. SCALAR 360 DEGREE MARKET PERSPECTIVE
  12. APPENDIX
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