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Embedded Die Packaging Technology Market, by Platform (Embedded Die in IC Package Substrate, Embedded Die in Rigid Board, Embedded Die in Flexible Board), Industry Vertical (Consumer Electronics, IT & Telecommunication, Automotive, Healthcare, Others) – Global Revenue, Trends, Growth, Share, Size and Forecast to 2022

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Embedded die packaging technology is wherein the die is directly embedded into printed circuit board laminated substrate. This technology is mostly used in manufacturing and it offers several benefits such as power saving, size reduction, and improving the overall system efficiency on a large scale. Embedded die packaging technology can be differentiated broadly into two types, namely, Flip Chip Chip Scale Packaging and Wafer Level Chip Scale Packaging and both these technologies are growing at a steady pace globally. Embedded die packaging technology is extensively used in telecommunication industry as it offers outstanding performance at higher frequencies. This report studies the current and future aspects of embedded die packaging technology market.

The report on the global Embedded die packaging technology market uses the top-down and bottom-up approaches to define, analyze, and describe the market trends for the next five years. The report also tracks the emerging applications, innovative technologies, and mergers & acquisitions. It also focuses on the growth drivers and restraints for the key market players during the forecast period.

KEY BENEFITS OF THE REPORT

  • In-depth analysis of the market ecosystem and its impact on the revenue growth
  • Understanding of the strategies that are being adopted by the key players in this market to stay competitive
  • Valuable insights into the key technological and market trends impacting this market

KEY PREMIUM INDUSTRY INSIGHTS

  • Embedded die packaging technology market is growing globally with its demand increasing every year. The rise in demand for circuit compactness in microelectronic devices and rise in number of portable electronic devices are some of the major factors driving the market.
  • The increased application of embedded die packaging in healthcare and automotive sectors is boosting the market growth. Embedded die packaging technology offers greater advantages as compared to other advanced packaging technologies, such as, compactness, reliability, higher signal density and so on, which is promoting the growth of the market among the manufacturing industries.
  • In addition, growing trend of Internet of Things (IoT) technology is created newer growth opportunities for the market. However, high cost of the chips is hampering the growth of embedded die packaging technology market.

The embedded die packaging technology market is divided into five major geographical segments which are North America, Europe, Asia-Pacific, Middle East & Africa and Latin America. The North America region holds the highest market share and is the largest revenue contributor for the global embedded die packaging technology market. North America region holds dominance because of increased adoption of IoT, well-developed telecom industry, and growth of automotive industry. Companies are also investing heavily into research and development of the technology, helping the market grow. The embedded die packaging technology is estimated to grow at a steady pace during the forecasted period.

RESEARCH METHODOLOGY

The research methodology for Scalar Market Research’s embedded die packaging technology market report utilizes a combination of top-down and bottom-up research formats. Our primary focus on continuous market tracking, rigorous fact-checking, data-triangulation, and multiple layers of quality control ensures high-quality data that can be leveraged for actionable research insights.

To know about the assumptions considered for the study, Download PDF Sample.

MARKET SEGMENTATION

This report analyzes the embedded die packaging technology market by the following segments:

  • Embedded Die Packaging Technology Market, by Platform
    • Embedded Die in IC Package Substrate
    • Embedded Die in Rigid Board
    • Embedded Die in Flexible Board
  • Embedded Die Packaging Technology Market, by Industry Vertical
    • Consumer Electronics
    • IT & Telecommunication
    • Automotive
    • Healthcare
    • Others

KEY MARKET PLAYERS

Key players in the embedded die packaging technology market include:

  • Amkor technology
  • Ase group
  • AT & S
  • Fujikura ltd.
  • General electric
  • Infineon technologies as
  • Microsemi corporation
  • Schweizer electronics ag
  • Taiwan semiconductor manufacturing company limited
  • TDK corporation

GEOGRAPHIC COVERAGE AND ANALYSIS

This granular market research report covers the following geographic regions in great detail:

  • NORTH AMERICA
    • U.S.
    • Rest of North America
  • EUROPE
    • France
    • Germany
    • U.K.
    • Rest of Europe
  • ASIA-PACIFIC
    • China
    • India
    • Japan
    • Rest of Asia-Pacific
  • MIDDLE EAST & AFRICA
    • GCC
    • North Africa
    • South Africa
    • Rest of Middle East & Africa
  • LATIN AMERICA
    • Brazil
    • Rest of Latin America

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  1. MARKET OVERVIEW
    1. Market Definitions
    2. Research Methodology
    3. Market Segmentation
  2. EXECUTIVE SUMMARY
  3. MARKET DYNAMICS
    1. Drivers
    2. Restraints
    3. Opportunities
    4. Premium Industry Trends
  4. INDUSTRY ANALYSIS
    1. Value Chain Analysis
    2. Technology Roadmap
  5. EMBEDDED DIE PACKAGING TECHNOLOGY MARKET, BY PLATFORM
    1. Segment Share
    2. By Platform
      1. Embedded Die in IC Package Substrate
      2. Embedded Die in Rigid Board
      3. Embedded Die in Flexible Board
  6. EMBEDDED DIE PACKAGING TECHNOLOGY MARKET, BY INDUSTRY VERTICAL
    1. Segment share
    2. By Industry Vertical
      1. Consumer Electronics
      2. IT & Telecommunication
      3. Automotive
      4. Healthcare
      5. Others
  7. EMBEDDED DIE PACKAGING TECHNOLOGY MARKET, BY GEOGRAPHY
    1. Segment Share
    2. North America
      1. By Regions
        1. U.S.
        2. Rest of North America
      2. By Platform
      3. By Industry Vertical
    3. Europe
      1. By Region
        1. France
        2. Germany
        3. U.K.
        4. Rest of Europe
      2. By Platform
      3. By Industry Vertical
    4. Asia-Pacific
      1. By Region
        1. China
        2. India
        3. Japan
        4. Rest of Asia-Pacific
      2. By Platform
      3. By Industry Vertical
    5. Middle East & Africa
      1. By Region
        1. GCC
        2. North Africa
        3. South Africa
        4. Rest of Middle East & Africa
      2. By Platform
      3. By Industry Vertical
    6. Latin America
      1. By Region
        1. Brazil
        2. Rest of Latin America
      2. By Platform
      3. By Industry Vertical
  8. COMPETITIVE LANDSCAPE
    1. Market Positioning of Key Players, 2016
    2. Key Innovators
  9. KEY MARKET PLAYERS
    1. Amkor technology
      1. Overview
      2. Key Strategies
      3. Key Developments
    2. Ase group
      1. Overview
      2. Key Strategies
      3. Key Developments
    3. AT & S
      1. Overview
      2. Key Strategies
      3. Key Developments
    4. Fujikura ltd.
      1. Overview
      2. Key Strategies
      3. Key Developments
    5. General electric
      1. Overview
      2. Key Strategies
      3. Key Developments
    6. Infineon technologies as
      1. Overview
      2. Key Strategies
      3. Key Developments
    7. Microsemi corporation
      1. Overview
      2. Key Strategies
      3. Key Developments
    8. Schweizer electronics ag
      1. Overview
      2. Key Strategies
      3. Key Developments
    9. Taiwan semiconductor manufacturing company limited
      1. Overview
      2. Key Strategies
      3. Key Developments
    10. TDK corporation
      1. Overview
      2. Key Strategies
      3. Key Developments
  10. SCALAR 360 DEGREE MARKET PERSPECTIVE
  11. APPENDIX
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